PELCO® Colloidal Silica Suspensions Select:CS2 position the wafer substrate on

position the wafer substrate on the film and press down with firm pressure to insure adhesion

Transfer Atomic Force Microscopy Discs from Diskpenser to PELCO® AFM Workstation to Microscope and to PELCO® AFM Disc Carrier or AFM Disc Storage Box with ease

specially formulated adhesive for demanding bonding applications such as:

I - 16035 SDS (121KB PDF)

Solid contents (nickel): 47-52%

PELCO® Colloidal Silica Suspensions Select:CS2 position the wafer substrate onDESCRIPTION PELCO Colloidal Silica Suspensions are ideal for the final polishing of materials for which a high quality, visibly scratch free surface is required. Three new formulations are provided, each with a specific average particle size and with increased alkalinity for an enhanced Chemical Mechanical Polishing (CMP) effect. PELCO Colloidal Silica CS1 with an average particle size of 80nm and pH value of 9. 9 is ideal for many metallographic